CPU / Chipset

• 6th Generation Intel^® Core™ LGA1151 Processor, Max 35W
• Intel^® H110 Express Chipset

Main Memory

• 2 x DDR4 SO-DIMM memory Socket with non-ECC support, up to 32 GB 2133/1876MHZ

BIOS

• AMI (UEFI)

Display

• 1 x box header (resolution up to 1920x1080@60Hz)
• 1 x HDMI1.4 connector (resolution up to 4096x2304@24Hz)

System

• 4 x Gbe LAN :
  2x I211AT GbE LAN on rear I/O
  2x I210AT GbE LAN on internal I/O, one port support PoE, IEEE
  802.3af compliant (NISKPOE Board, optional)
• 2 x USB3.0, 6 x USB2.0
• 2 x RS232/485/422
  1x DB9 for RS232/RS422/RS485 with auto flow control
  1x DB9 for RS232/RS422/RS485, signal from 2x5 pin header
• 12x GPI, 4 GPO, WDT
• 2 x Smart Fan connector
• On-Board Isolated I/O: 8in(Source type), 8out(Sink type)

Storage

• 1 x SATA III (6.0Gb/s) ports

Expansion Slot

• 1x PCIex16, 1 x Mini PCIe

Rear I/O

• 2 x DB9 for RS232/422/485
• 1 x HDMI
• 1 x 4 deck USB2.0
• 1 x DB15 for VGA
• 4 x LAN port
• 1x 3pin Terminal block for DC24V in, pin define: +24V, GND, NC

Front I/O

• 1 x Power switch
• 1 x Reset switch
• 2 x USB2.0 Double deck
• 1 x DB25 for GPIO

Power Requirement

• 1 x 4-pin ATX Power Connector input
• DC24 input ±10%
• AT/ATX power mode (by jumper setting, default AT)

Dimensions

• 298.6 mm(W) x 249mm (D) x 68mm (H)
• without wall mount bracket [260 mm(W) x 249mm (D) x 58mm (H)]

Environment

• Board level operation temperture: 0°C to 50°C
• Storage temperature: -20˚C to 80˚C
• Relative humidity:
  10% to 90% (operating, non-condensing)
  5% to 90% (non-operating, non-condensing)

Certifications

• Meet CE/FCC Class A

Shock

• 50g peak acceleration (11 msec. duration)
• SE: HDD
• IRT: SSD (non-operation)

Vibration

• Non-operation (X-Y-Z): Sine vibration (SE: SSD / IRT: SSD)
  Sine wave vibration test: Acceleration: 2g rms
  Frequency: 5 – 500 Hz
• Operation (X-Y-Z): Random vibration (IRT: SSD)
  Random vibration test (Operating): Accelerate: 2g rms
  Frequency: 5 – 500 Hz